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IEEE JOURNAL OF SOLID-STATE CIRCUITS《IEEE固态电路杂志》 (官网投稿)

简介
  • 期刊简称IEEE J SOLID-ST CIRC
  • 参考译名《IEEE固态电路杂志》
  • 核心类别 高质量科技期刊(T2), SCIE(2024版), 目次收录(维普), 目次收录(知网),外文期刊,
  • IF影响因子
  • 自引率18.50%
  • 主要研究方向工程技术-ENGINEERING, ELECTRICAL & ELECTRONIC工程:电子与电气

主要研究方向:

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工程技术-ENGINEERING, ELECTRICAL & ELECTRONIC工程:电子与电气

IEEE JOURNAL OF SOLID-STATE CIRCUITS《IEEE固态电路杂志》(月刊). The IEEE Journal of Solid-State Circuits publishes papers each month in the broad...[显示全部]
征稿信息

万维提示:

1、投稿方式:在线投稿。

2、期刊网址:

https://sscs.ieee.org/publications/ieee-journal-of-solid-state-circuits-jssc

https://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=4

3、投稿网址:

http://mc.manuscriptcentral.com/jssc-ieee

4、官网邮箱:jsscadmin@ieee.org

jssc@illinois.edu(主编)

(更多编辑邮箱请查看期刊官网信息)

5、期刊刊期:月刊,一年出版12期。

2021年1214日星期二

                                

 

投稿须知【官网信息】

 

JSSC Submission - Information for Authors

ScholarOne Web-Based Submission and Review

The JSSC uses the web-based ScholarOne system for the submission and review of manuscripts. ScholarOne makes it easier and more efficient for authors, reviewers and editors. The JSSC ScholarOne site is http://mc.manuscriptcentral.com/jssc-ieee.

All IEEE journals require an Open Researcher and Contributor ID (ORCID) for all authors. To create an ORCID, please visit: https://orcid.org/register. The author will need a registered ORCID in order to submit a manuscript or review a proof in this journal.

Style for Manuscript Submissions

All papers must be submitted using the IEEE TRANSACTIONS two-column format. For general manuscript preparation guidelines, visit the IEEE Author Center at http://ieeeauthorcenter.ieee.org/. Article templates, including guidance on stylistic elements such as figures, tables, equations, abbreviations, etc. are available at: http://ieeeauthorcenter.ieee.org/create-your-ieee-article/use-authoring-tools-and-ieee-article-templates/ieee-article-templates/templates-for-transactions/.

Figures and tables must be placed inline at their relevant position in the text. Author names and affiliatins are mandatory, but biographies are optional during the review process.

Prepublication Policy

During submission, all related prior publications and related current submissions in other journals or conferences should be fully declared. Include a pdf copy of those papers, as well as a prepublication statement explaining the overlap and differences of the submitted manuscripts for the convenience of the reviewers. Furthermore, authors should inform the Editor-in-Chief of any related submissions made while their JSSC submission is in review.

Prior and related publications obviously refers to e.g. earlier conference papers on which the JSSC manuscript elaborates. But also other publications where (part of) the submitted work was disclosed, earlier work of you or your group in the same field on which the submitted manuscript builds further, etc. must be included.

Please consider this list carefully. An automated plagiarism check is performed on each submission, and violations of this prepublication policy detected during the review process may result in a publication ban.

Manuscript length

Submitted manuscripts, describing both the theoretical and implementation aspects of an advance solid-state circuit design, are allowed to have up to 8 pages in the two-column format described above. This page limit is valid for the whole manuscript, but excluding references and bios. All figures must be sized such that they are properly readable. No modifications to the IEEE templates are allowed.

Exceptions of up to 4 extra pages are possible for systems or topics that do not fit in this regular length. To request such an exception, a detailed motivation must be provided at the time of submission. Exceptions are subject to approval by the editorial board.

During revisions, deviations on this page limit are allowed if more material is requested by the editor or reviewers.

Copyright

Submission of a manuscript manifests the fact that it has received proper clearance from the author’s company or institution, that it has not been copyrighted, published, submitted, or accepted for publication elsewhere, and that it will not be submitted elsewhere while under consideration. The manuscript text should not contain any commercial references, such as company names, university names, trademarks, commercial acronyms, or part numbers.

IEEE owns copyright to the technical contributions it publishes. To comply with the U.S. Copyright Law, authors are required to sign an IEEE copyright transfer form. Authors can sign and  submit an electronic version of the copyright form while submitting their manuscript through ScholarOne.

Review Process

The first round of the review process usually requires about three months. The author is then notified of the decision of the Editor or Associate Editor based on reviewer recommendations. The authors may be asked to revise the manuscript if it is not accepted, or rejected in its original form. The elapsed time between receipt of a manuscript and publication is usually about 8 months, but is heavily dependent on the quality and clarity of  the original manuscript.

Authors are therefore strongly requested to report on their work as open and clearly as possible in their original manuscript submissions. The editors and reviewers understand that not always all aspects of the design presented are perfect, but hiding such items from the readers is often a reason for several revisions, and often even rejection. The solid-state circuits community will also learn from the less-good aspects of the design presented, so authors are encouraged to present those as well.

The articles in this journal are peer reviewed in accordance with the requirements set forth in the IEEE Publication Services and Products Board Operations Manual (Sections 8.2.1C and 8.2.2A). Each published article was reviewed by a minimum of two independent reviewers using a single-blind peer review process, where the identities of the reviewers are not known to the authors, but the reviewers know the identities of the authors. Articles will be screened for plagiarism before acceptance.

Open Access

This publication is a hybrid journal, allowing either Traditional or Open Access (author-pays OA) manuscript submission. Upon submission, if you choose to have your manuscript be an Open Access article, you commit to pay the discounted $1,950 OA fee if your manuscript is accepted for publication in order to enable unrestricted public access. Any other application charges (such as charge for the use of color in the print format) will be billed separately once the manuscript formatting is complete but prior to publication. If you would like your manuscript to be a Traditional submission, your article will be available to qualified subscribers and purchasers via IEEE Xplore. No OA payment is required for Traditional submission. Corresponding authors from low-income countries are eligible for waived or reduced open access APCs.

Page Charges

Papers will be reviewed for their technical merit, and decisions to publish will be made independently of an author’s ability to pay page charges. A voluntary page charge of $110 per printed page will be requested with the galley proof to cover the cost of publication. The author will receive 100 free reprints without covers if the voluntary charge is honored.

Starting for papers submitted after October 1st, 2018,  the SSCS will apply mandatory overlength page charges. This is irrespective of the page limits applied during submission, hence also applies to manuscripts that have obtained an exception for overlength submission. Charges are assessed when galley proofs are prepared, which is the last step before final publication in the Journal. Note that this could be slightly different from the formatting used by the authors during submission. If a manuscript exceeds ten pages in length, an mandatory overlength charge of $185 per page is applied beginning at the 11th page. The page count will not include the last page of the paper if the last page consists only of reference and bios. Exceptions on this must be discussed with the Editor-in-Chief.


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