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IEEE TECHNOLOGY AND SOCIETY MAGAZINE《IEEE技术与社会杂志》 (官网投稿)

简介
  • 期刊简称IEEE TECHNOL SOC MAG
  • 参考译名《IEEE技术与社会杂志》
  • 核心类别 SCIE(2024版), 目次收录(维普),外文期刊,
  • IF影响因子
  • 自引率
  • 主要研究方向工程技术-ENGINEERING, ELECTRICAL & ELECTRONIC工程:电子与电气

主要研究方向:

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工程技术-ENGINEERING, ELECTRICAL & ELECTRONIC工程:电子与电气

IEEE TECHNOLOGY AND SOCIETY MAGAZINE《IEEE技术与社会杂志》(季刊). IEEE Technology and Society Magazine invites feature articles (refereed), special articles...[显示全部]
征稿信息

万维提示:

1、投稿方式:在线投稿。

2、期刊网址:

https://technologyandsociety.org/technology-and-society-magazine/

https://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=44

3、投稿网址:https://mc.manuscriptcentral.com/tsm

4、官网邮箱:j.pitt@imperial.ac.uk(主编)

(更多编辑邮箱请查看期刊官网信息)

5、官网电话:+44 (0) 20 7594 6318(主编)

6、期刊刊期:季刊,逢季末月出版。

2021年1215日星期三

                                

 

投稿须知【官网信息】

 

Information for Authors

IEEE Technology and Society Magazine invites feature articles (refereed), special articles, and commentaries on topics within the scope of the IEEE Society on Social Implications of Technology, in the broad areas of social implications of electrotechnology, history of electrotechnology, and engineering ethics.

Submitted manuscripts for articles should typically be no longer than 5000 words. Commentaries (up to 1000 words) and letters to the editor (under 500 words) often focus on previously published papers, IEEE and SSIT affairs, and conferences. References and footnotes should appear as separate lists at the end of the paper.

Submissions are through the IEEE Manuscript Central Scholar One system (see “Submitting a Manuscript below.) Please note that while Manuscript Central accepts pdf submissions, after acceptance an original Word or RTF file will be required.

Authors are required to sign an IEEE copyright transfer form before publication of their paper and to obtain any necessary security clearance release. Additional information will accompany the acceptance letter.

Submitting a Manuscript

Submit your manuscript to IEEE Technology and Society Magazine directly through the IEEE Manuscript Central Scholar One system at:

https://mc.manuscriptcentral.com/tsm


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