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IEEE Transactions on Haptics《IEEE触觉论汇刊》 (官网投稿)

简介
  • 期刊简称IEEE T HAPTICS
  • 参考译名《IEEE触觉论汇刊》
  • 核心类别 高质量科技期刊(T3), SCIE(2024版), 目次收录(维普), 目次收录(知网),外文期刊,
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  • 主要研究方向计算机科学-COMPUTER SCIENCE, CYBERNETICS计算机:控制论

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计算机科学-COMPUTER SCIENCE, CYBERNETICS计算机:控制论

IEEE Transactions on Haptics《IEEE触觉论汇刊》(季刊). IEEE Transactions on Haptics (ToH) is a scholarly archival journal that addresses the scie...[显示全部]
征稿信息

万维提示:

1、投稿方式:在线投稿。

2、期刊网址:

https://www.ieee-ras.org/publications/toh

https://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=4543165

3、投稿网址:https://mc.manuscriptcentral.com/toh

4、官网邮箱:dprattichizzo@unisi.it(主编)

(更多编辑邮箱请查看期刊官网信息)

5、期刊刊期:季刊,一年出版4期。

2021年1118日星期四

                          

 

投稿须知【官网信息】

 

Information for Authors

IEEE Transactions on Haptics (ToH) is a scholarly archival journal that addresses the science, technology and applications associated with information acquisition and object manipulation through touch. Haptic interactions relevant to this journal include all aspects of manual exploration and manipulation of objects by humans, machines and interactions between the two, performed in real, virtual, teleoperated or networked environments.

Research areas of relevance to this publication include, but are not limited to, the following topics:

Human haptic and multi-sensory perception and action

Aspects of motor control that explicitly pertain to human haptics

Haptic interactions via passive or active tools and machines

Devices that sense, enable, or create haptic interactions locally or at a distance

Haptic rendering and its association with graphic and auditory rendering in virtual reality

Algorithms, controls, and dynamics of haptic devices, users, and interactions between the two

Human-machine performance and safety with haptic feedback

Haptics in the context of human-computer interactions

Systems and networks using haptic devices and interactions, including multi-modal feedback

Application of the above, for example in areas such as education, rehabilitation, medicine, computer-aided design, skills training, computer games, driver controls, simulation and visualization.

Submission Procedures

To submit your paper, please use ScholarOne Manuscripts.

Manuscript types accepted by ToH

ToH manuscript types and submission length guidelines are as follows:

Regular paper – 12 double column pages (Note: All regular paper page limits include references and author biographies)

Short paper – 6 double column pages (Note: Page limits include references.  No author biographies are required.)

Survey paper – 14 double column pages

Comments paper – 2 double column pages

Pages in excess of these limits are accepted only at the discretion of the EIC and are subject to a $200 mandatory overlength charge. Regular and Survey papers may not exceed 20 formatted transactions pages. Short papers may not exceed 8 pages. Papers submitted in the ToH to haptics conference track (either the World Haptics Conference or the Haptics Symposium) cannot exceed 6 pages Please note that double columns will translate more readily into the final publication format.These length limits are taking into account reasonably-sized figures and references.

Templates for Transactions (Regular and Survey Papers)

Templates for Short Papers

How to Create Your Article

Grammar and style

Manuscripts are instruments for communicating ideas, and as such must be written clearly. Authors are expected to edit their submissions carefully to eliminate grammatical errors and maintain a scholarly style. Editors may, at their own discretion, require improvements to grammar and style before a manuscript is either reviewed or accepted. The ToH staff will provide contact information for professional editing services, but the responsibility for manuscript editing, including financial responsibility, will reside with the authors.

Open access

This publication is a hybrid journal, allowing either Traditional manuscript submission or Open Access (author-pays OA) manuscript submission.The OA option, if selected, enables unrestricted public access to the article via IEEE Xplore. The OA option will be offered to the author at the time the manuscript is submitted. If selected, the OA discounted fee of $2,045 must be paid before the article is published in the journal. If you have unusual circumstances about this, please contact the Editor-in-Chief. Any other applicable charges (such as the over-length page charge and/or charge for the use of color in the print format) will be billed separately once the manuscript formatting is complete but prior to the publication.The traditional option, if selected, enables access to all qualified subscribers and purchasers via IEEE Xplore. No OA payment is required.

ORCID

ORCID Required: All IEEE journals require an Open Researcher and Contributor ID (ORCID) for all authors. ORCID is a persistent unique identifier for researchers and functions similarly to an article's Digital Object Identifier (DOI). ORCIDs enable accurate attribution and improved discoverability of an author's published work. The author will need a registered ORCID in order to submit a manuscript or review a proof in this journal.

Peer Review Model

If journal uses single-blind review

The articles in this journal are peer reviewed in accordance with the requirements set forth in the IEEE Publication Services and Products Board Operations Manual (https://pspb.ieee.org/images/files/files/opsmanual.pdf). Each published article was reviewed by a minimum of two independent reviewers using a single-blind peer review process, where the identities of the reviewers are not known to the authors, but the reviewers know the identities of the authors.

If journal uses double-blind review

The articles in this journal are peer reviewed in accordance with the requirements set forth in the IEEE Publication Services and Products Board Operations Manual (https://pspb.ieee.org/images/files/files/opsmanual.pdf). Each published article was reviewed by a minimum of two independent reviewers using a double-blind peer review process, in which the identities of the reviewers are not known to the authors, and the identities of the authors are not known to the reviewers.

Templates for Short Papers:

If you use LaTeX for preparing a Short Paper, please download the following files for document preparation:

The zipped file pack ieeeconf.zip. This contains the LaTeX class file ieeeconf.cls, a sample LaTeX source file root.tex and the compiled document root.pdf.

BiBTeX files IEEEtranBST.zip

Guide to use ieeeconf.cls (based on IEEEtrans.cls) IEEEtran_HOWTO.pdf

The document should be configured for US Letter paper, using the line

\documentclass[letterpaper, 10 pt, conference]{ieeeconf}

If you use MSWord for preparing a Short Paper, please download the following files for document preparation

MS Word template ieeeconf_letter.dot for US Letter paper

Sample Documents ieeeconf_letter.doc and sample_A4.doc

When using the IEEE style format, the first (title) page will contain the paper title and each author's name, affiliation, and full address (mailing address, email address, and fax number), with the corresponding author clearly indicated, the abstract (no more than 200 words), the keywords (index terms), and the beginning of the main text of the paper. Do not use a cover page


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