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铜新材(英文)(cMat)(OA期刊) (官网投稿)

简介
《铜新材(英文)》(cMat)(季刊),创刊于2024年,由江西省国有资产监督管理委员会主管,江西铜业集团有限公司、中国有色金属学会联合主办,有科期刊出版(北京)有限公司负责出版。cMat以Copper(铜)为关注核心,涵盖Chemistry(化学)、Composite(复合)、Catalyst(催化)、Carbon(碳材料)、Chip(芯片)、Coating(涂层)、Cycle(资源回收)、Conduction(传导)、Cell(生物...[显示全部]
本刊为:目次收录(维普), 知网外文库,外文期刊,
征稿信息

万维提示:

1、投稿方式:在线投稿。

2、刊内网址(202501期):

https://onlinelibrary.wiley.com/journal/30062691

3、投稿系统:

https://wiley.atyponrex.com/journal/CMT2

4、官网邮箱:cmat-editor@youkepub.com

  电子邮箱:cmat@jxcc.com(微信公众号信息)

5、官网电话:010-82241917

6、出刊日期:季刊,逢季末月出版。

7、公众号信息:前三年(2024-2026年)无出版费。

2025811日星期一

                     

 

投稿指南Author Guidelines

【官网信息】

 

1. SUBMISSION

Thank you for your kind interest in cMat. Submissions have to consist of content that has not been published or submitted for publication elsewhere except those as the brief abstracts in the proceedings of conferences or symposiums.

Once you have prepared your submission in accordance with the Guidelines, manuscripts should be submitted online at https://wiley.atyponrex.com/journal/CMT2.

The cover letter must contain:

A statement confirming the paper has not been published or submitted for publication elsewhere except as a brief abstract in the proceedings of a scientific meeting or symposium.

An acknowledgment that all authors have contributed significantly.

A statement confirming that all authors are in agreement with the content of the manuscript.

In addition, authors should clearly state the motivation behind and the novelty of their research in the cover letter. Authors should also clarify key results and the advances made compared with their previous work.

Free Format submission

cMat now offers Free Format submission for a simplified and streamlined submission process for New Submissions.

Before you submit, you will need:

Your manuscript: this should be an editable file including text, figures, and tables, or separate files—whichever you prefer. All required sections should be contained in your manuscript, including abstract, introduction, methods, results, and conclusions. Figures and tables should have legends. Figures should be uploaded in the highest resolution possible. References may be submitted in any style or format, as long as it is consistent throughout the manuscript. You can find the recommended format below. Supporting information should be submitted in separate files. If the manuscript, figures or tables are difficult for you to read, they will also be difficult for the editors and reviewers, and the editorial office will send it back to you for revision. Your manuscript may also be sent back to you for revision if the quality of English language is poor.

An ORCID ID (required), freely available at https://orcid.org. (Why is this important? Your article, if accepted and published, will be attached to your ORCID profile. Institutions and funders are increasingly requiring authors to have ORCID IDs.)

The title page of the manuscript, including:

Your co-author details, including affiliation and email address. (Why is this important? We need to keep all co-authors informed of the outcome of the peer review process.)

Statements relating to our ethics and integrity policies, which may include any of the following (Why are these important? We need to uphold rigorous ethical standards for the research we consider for publication):

data availability statement

funding statement

conflict of interest disclosure

ethics approval statement

patient consent statement

permission to reproduce material from other sources

clinical trial registration

 

Refer and Transfer Program

Wiley believes that no valuable research should go unshared. This journal participates in Wiley’s Refer & Transfer program. If your manuscript is not accepted, you may receive a recommendation to transfer your manuscript to another suitable Wiley journal, either through a referral from the journal’s editor or through our Transfer Desk Assistant

2. AIMS AND SCOPE

cMat, to the world's scientific and technological frontier, to the main economic battlefield, and to the major national needs, focuses on the cross-integration of materials (including metallurgy), minerals, geology, chemistry, and other fields related to the research of copper, gold, rare earth, silver, lead, zinc, tungsten, and rare metals. Its critical focus areas is the innovative development mode of emerging cutting-edge technologies in the fields of mining, milling and metallurgy, such as metaverse, artificial intelligence, computer simulation and process simulation, as well as the latest scientific research achievements and applications of copper-related advanced materials in aerospace (such as superalloy), energy (such as catalyst in energy conversion and storage), nanotechnology (such as nanomaterials), biomedicine (such as antimicrobial agent), electronics (such as superconductor and semiconductor), supramolecular chemistry (such as Cu ion as ligand), etc.

It aims to become a domestic and international first-class science and technology journal in copper related fields. It is committed to creating a cutting-edge, open, and innovative academic platform integrating science and engineering, providing a research result display platform for researchers in relevant universities, research institutions and front-line R&D personnel.

……

更多详情:

https://onlinelibrary.wiley.com/page/journal/30062691/homepage/author-guidelines


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