万维书刊网微信二维码

扫微信,关注编辑QQ!

您的位置:万维书刊网 >>sci/e期刊大全 >>工程技术2>>工程(电子与电气)

JOURNAL OF ELECTRONIC PACKAGING《电子封装杂志》 (官网投稿)

简介
  • 期刊简称J ELECTRON PACKAGING
  • 参考译名《电子封装杂志》
  • 核心类别 SCIE(2024版), 目次收录(维普), 目次收录(知网),外文期刊,
  • IF影响因子
  • 自引率17.10%
  • 主要研究方向工程技术-ENGINEERING, MECHANICAL工程:机械;ENGINEERING, ELECTRICAL & ELECTRONIC工程:电子与电气

主要研究方向:

等待设置主要研究方向
工程技术-ENGINEERING, MECHANICAL工程:机械;ENGINEERING, ELECTRICAL & ELECTRONIC工程:电子与电气

JOURNAL OF ELECTRONIC PACKAGING《电子封装杂志》(季刊). The Journal of Electronic Packaging publishes papers that use experimental and theoretical (ana...[显示全部]
征稿信息

万维提示:

1、投稿方式:在线投稿。

2、期刊网址:

https://asmedigitalcollection.asme.org/electronicpackaging

3、投稿网址:

https://journaltool.asme.org/home/index.cfm

4、官网邮箱:rickylee@ust.hk(主编)

5、官网电话:+852-23587203(主编)

6、期刊刊期:季刊,逢季末月出版。

2021年1214日星期二

                                

 

期刊信息【官网信息】

 

About the Journal

Purpose

The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems.

Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems

Diversity and Inclusion The Technical Committee on Publications and Communications endorses the commitment of ASME to support diversity and to create and ensure inclusive and ethical practices for publishing as well as the science and engineering professions.

Frequency: Quarterly

 

Information for Authors

ASME Journal Information for Authors

Comprehensive information and instructions for prospective ASME authors

投稿须知:

https://www.asme.org/publications-submissions/journals/information-for-authors


  • 万维QQ投稿交流群    招募志愿者

    版权所有 Copyright@2009-2015豫ICP证合字09037080号

     纯自助论文投稿平台    E-mail:eshukan@163.com


投稿问答最小化  关闭