万维提示：
1、投稿方式：在线投稿。
2、期刊网址：
https://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=15
3、投稿网址：
https://mc.manuscriptcentral.com/temc-ieee
4、官网邮箱：tlwu@ntu.edu.tw（主编）
5、官网电话：+886-233663690（主编）
6、期刊刊期：双月刊，一年出版6期。
2021年12月15日星期三
投稿须知【官网信息】
EMC SOCIETY POLICY
Papers published in IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY should be designed to serve the members of the IEEE, the EMC Society, and the EMC Profession. These objectives can best be met by maintaining high technical standards and publishing new EMC developments in the various areas of interest to the EMC Society, including: EM Environment, ESD, Lightning and EMP, HIRF, IEMI, Emission, Coupling, Lines and Cables, Cavities and Enclosures, Printed Circuit Boards, Electronic Interconnects and Packaging, Signal Integrity, Immunity, Shielding and Filters, Grounding, Antennas and Propagation, Wireless Communications, Biomedical Devices, Equipment and Systems EMC, Numerical Modeling, Absorbers, Metamaterials, Nanotechnology, Chambers and Cells, Measurement Technology, Standards, Spectrum Utilization, Radiation Hazards, and Human Exposure to EM Fields.
INFORMATION FOR AUTHORS
The IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY is a medium through which the engineering profession may benefit from your EMC activity. The editorial staff is interested in reviewing a full format paper, a letter, or correspondence.
PAPERS are the proper vehicle for the presentation of thorough EMC engineering work of archival (long-lasting) value, including advances in the state of the art, both theoretical and experimental. Author(s) are encouraged to provide the most value per page by presenting their work as compactly as possible while being thorough and complete. To estimate the length of a manuscript, assume 900 words per published page, 1/6 page per figure, and 40 words for each equation. Each paper must include an abstract and keywords (indexing terms). Moreover, the authors should clearly indicate the most relevant EMC aspects of their paper in the Introduction.
LETTERS are the format for rapid publication of recent research results. They are typically narrower in scope and shorter than papers. Their length must not exceed four printed pages in double-column format, including figures.
CORRESPONDENCES are used for the brief presentation of technical issues, and for the correction or discussion of papers in earlier issues.
Their length should not exceed two printed pages in double-column format, including figures.
REVIEW of Letters and Correspondences will be a one-step process, ie., the manuscript is either accepted as submitted with no substantial changes, or is rejected.
ELECTRONIC SUBMISSION of manuscripts is requested. Author(s) must submit their manuscript on the web to ScholarOne manuscripts link. From this entry page, access can be obtained to all information required for the submission of a manuscript. It should be noted that manuscripts must be submitted following the IEEE Style. This style can be found on http://www.ieee.org/documents/stylemanual.pdf. The template is available at http://www.ieee.org/documents/TRANS-JOUR.doc.
It is the policy of IEEE to own the copyright to the technical contribution it publishes on the behalf of the interests of the IEEE, its authors, and their employers, and to facilitate the appropriate reuse of this material by others. To comply with the U.S. Copyright Law, authors are required to sign a new IEEE copyright form (http://www.ieee.org/documents/IEEECForm121302pdf_1.pdf) before publication. This form returns, to authors and their employers, full rights to reuse their material for their own purposes. Upon final acceptance of the manuscript, it must comply with IEEE Periodicals requirements for text and graphics processing. Details can be found at http://www.ieee.org/publications_standards/publications/authors/authors_journals.html. All final files have to submitted through the awaiting final files queue in the author center on ScholarOne. The final package has to be complete upon submission. Once the submission is completed, it is impossible to make changes until the page proofs are submitted from the IEEE.
If you are in doubt, do not hesitate to inquire using help@ep.ieee.org.
OPEN ACCESS: This publication is a hybrid journal, allowing either Traditional manuscript submission or Open Access (author-pays OA) manuscript submission. Upon submission, if you choose to have your manuscript be an Open Access article, you commit to pay the discounted $1,750 OA fee if your manuscript is accepted for publication in order to enable unrestricted public access. Any other application charges (such as over-length page charge and/or charge for the use of color in the print format) will be billed separately once the manuscript formatting is complete but prior to the publication. If you would like your manuscript to be a Traditional submission, your article will be available to qualified subscribers and purchasers via IEEE Xplore. No OA payment is required for Traditional submission.
PAGE CHARGE: After a manuscript has been accepted for publication, the author’s company or institution will be requested to pay a charge of $110 per printed page to cover part of the cost of publication. Page charges for the IEEE TRANSACTIONS are not obligatory, nor is their payment a prerequisite for publication. If the charge is honored, the author will receive 100 free reprints without covers. Detailed instructions will accompany the proofs.
An OVERLENGTH PAGE CHARGE of $200 for each printed page (or portion of a page) over eight (Papers), four (Letters) and two (Correspondence) will be assessed.
Editor-in-chief contact: Prof. Dr. Farhad Rachidi, Swiss Federal Institute of Technology (EPFL), EMC Laboratory, EPFL-SCI-STI-FR, Station 11, CH-1015 Lausanne, Switzerland. Telephone: +41 21 693 26 20, Fax: +41 21 693 46 62, E-mail: farhad.rachidi@epfl.ch.
