万维提示：
1、投稿方式：在线投稿。
2、期刊网址：
https://asmedigitalcollection.asme.org/electronicpackaging
3、投稿网址：
https://journaltool.asme.org/home/index.cfm
4、官网邮箱：rickylee@ust.hk（主编）
5、官网电话：+852-23587203（主编）
6、期刊刊期：季刊，逢季末月出版。
2021年12月14日星期二
期刊信息【官网信息】
About the Journal
Purpose
The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems.
Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems
Diversity and Inclusion The Technical Committee on Publications and Communications endorses the commitment of ASME to support diversity and to create and ensure inclusive and ethical practices for publishing as well as the science and engineering professions.
Frequency: Quarterly
Information for Authors
ASME Journal Information for Authors
Comprehensive information and instructions for prospective ASME authors
投稿须知：
https://www.asme.org/publications-submissions/journals/information-for-authors
